Basel, Switzerland and Peapack, NJ (USA), 01 February 2013 – Lonza Ltd and Novoset LLC are pleased to announce the introduction of a new generation of thermoset polyimides. The new polyimides address shortcomings of conventional high temperature polyimides currently available in the market and will serve semiconductor packaging, aerospace, abrasives, composite tooling, electronics, and other industries.
Lonza is marketing these products worldwide in collaboration with Novoset LLC under the Primaset™ trade name. The initial product, Primaset™ PPI-600, is now available in powdered and solvated form. Lonza and Novoset are working with selected customers to qualify this product for various leading-edge applications where long term thermo-oxidative stability and electric properties are critical. Furthermore, Lonza manufactures the key materials for this product.
Dr. Josef Schröer, Lonza’s Head of Business Development, High Performance Materials, said, “We are excited to add this new product to our portfolio. We believe Primaset™ PPI-600 will prove essential for high reliability in a wide array of applications from aerospace to under-the-hood automotive electronics. Primaset™ PPI-600 warrants for dimensional stability which is crucial for the latest IC substrates for high-end electronic gadgets.”
Dr. Sajal Das, CEO and President of Novoset LLC said, “We are pleased to collaborate with Lonza on this unique product. The new polyimide can be used readily in solvent-based prepregs but unlike other products in the market, also in other liquid processes such as resin transfer molding (RTM), resin infusion, filament winding and hot/melt resin processes.”
Lonza has developed the new product group in close collaboration with Novoset LLC and Cyalume Specialty Products, both based in New Jersey (USA).
About Lonza’s Primaset™ PPI-600
Primaset™ PPI-600 polyimide is soluble in common organic solvents at high amounts, and is ”melt-processable” in fully imidized form. When cured, the product exhibits a dry glass transition temperature (Tg) > 300˚C (600˚F); more than 90% of the glass transition temperature is maintained upon saturation with boiling water. The melt viscosity at 190˚C is less than 1200cP; at 200˚C the melt viscosity decreases below 700cP, enabling various liquid processes. The product also has very low ionic conductivity under harsh testing conditions.